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datasheet product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays . 1/16 tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com ac/dc drivers pwm type dc/dc converter ic included 650v mosfet bm2pxx4 series general the pwm type dc/dc converter (bm2pxx4) for ac/dc provide an optimum system for all products that include an electrical outlet. bm2pxx4 supports both isolated and non-isolated devices, enabling simpler design of various types of low-power electrical converters. bm2pxx4 built in a hv star ter circuit that tolerates 650v, it contributes to low-power consumption. with current detection resist ors as external devices, a higher degree of design freedom is achieved. since current mode control is utiliz ed, current is restricted in each cycle and excellent performance is demonstrated in bandwidth and transient response. the switching frequency is 65 khz. at light load, the switching frequency is reduced and high efficiency is achieved. a frequency hopping function is also on chip, which contributes to low emi. we can design easily, because bm2pxx4 includes the switching mosfet. basic specifications ? operating power supply voltage range: vcc 8.9v to 26.0v drain 650v ? operating current: normal mode BM2P014 :0.950ma (typ.) bm2p034 :0.775ma(typ) bm2p054 : 0.600ma(typ) bm2p094 : 0.500ma(typ) burst mode 0.400ma(typ.) ? oscillation frequency: 65khz(typ.) ? operating temperature: - 40deg. to +105deg. ? mosfet on resistance: BM2P014:1.4 ? (typ) bm2p034:2.4 ? (typ) bm2p054:4.0 ? (typ) bm2p094:8.5 ? (typ) features ? pwm frequency : 65khz ? pwm current mode method ? burst operation when load is light ? frequency reduction function ? built-in 650v start circuit ? built-in 650v switching mosfet ? vcc pin under voltage protection ? vcc pin overvoltage protection ? source pin open protection ? source pin short protection ? source pin leading-edge-blanking function ? per-cycle over current protection circuit ? soft start ? secondary over current protection circuit package dip7 9.20mm6.35mm4.30mm pitch 2.54mm (typ.) (typ.) (typ.) (typ.) applications ac adapters and household appliances (vacuum cleaners, humidifiers, air cleaners, air conditioners, ih cooking heaters, rice cookers, etc.) line up application circuit ac 85 - 265vac fuse + - filter diode bridge error amp figure 1 application circuit
2/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 absolute maximum ratings ta=25 c parameter symbol rating unit conditions maximum applied voltage 1 v max1 -0.3 30 v vcc maximum applied voltage 2 v max2 -0.3 6.5 v source, fb maximum applied voltage 3 v 650 v drain drain current pulse i dp 10.40 a p w =10us, duty cycle=1% (BM2P014) drain current pulse i dp 5.20 a p w =10us, duty cycle=1% (bm2p034) drain current pulse i dp 2.60 a p w =10us, duty cycle=1% (bm2p054) drain current pulse i dp 1.30 a p w =10us, duty cycle=1% (bm2p094) allowable dissipation p d 2000 mw when implemented operating temperature range t opr -40 +105 o c storage temperature range t str -55 +150 o c ( note1) dip7 : when mounted (on 74.2 mm 74.2 mm, 1.6 mm thick, glass epoxy on single-layer substrate). reduce to 16 mw/ c when ta = 25 c or above. operating conditions ta=25 c parameter symbol rating unit conditions power supply voltage range 1 vcc 8.9 26.0 v vcc pin voltage power supply voltage range 2 v drain 650 v drain pin voltage electrical characteristics of mosfet part (unless otherwise noted, ta = 25 c, vcc = 15 v) parameter symbol specifications unit conditions minimum standard maximum [mosfet block ] between drain and source voltage v (br)dds 650 - - v i d =1ma / v gs =0v drain leak current i dss - - 100 ua v ds =650v / v gs =0v on resistance r ds(on) - 1.4 2.0 ? i d =0.25a / v gs =10v (BM2P014) on resistance r ds(on) - 2.4 3.6 ? i d =0.25a / v gs =10v (bm2p034) on resistance r ds(on) - 4.0 5.5 ? i d =0.25a / v gs =10v (bm2p054) on resistance r ds(on) - 8.5 12.0 ? i d =0.25a / v gs =10v (bm2p094)
3/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics (unless otherwise noted, ta = 25 c, vcc = 15 v) parameter symbol specifications unit conditions minimum standard maximum [circuit current] circuit current (on) 1 i on1 700 950 1200 a BM2P014, fb=2.0v ( at pulse operation) circuit current (on) 1 i on1 550 775 1050 a bm2p034, fb=2.0v (at pulse operation) circuit current (on) 1 i on1 410 600 790 a bm2p054, fb=2.0v (at pulse operation) circuit current (on) 1 i on1 350 500 650 a bm2p094, fb=2.0v (at pulse operation) circuit current (on) 2 i on2 - 400 500 a fb=0.0v(at burst operation) [vcc protection function] vcc uvlo voltage 1 v uvlo1 12.50 13.50 14.50 v vcc rise vcc uvlo voltage 2 v uvlo2 7.50 8.20 8.90 v vcc drop vcc uvlo hysteresis v uvlo3 - 5.30 - v v uvlo3= v uvlo1- v uvlo2 vcc ovp voltage 1 v ovp1 26.0 27.5 29.0 v vcc rise vcc ovp voltage 2 v ovp2 23.5 v vcc drop latch released vcc voltage v latch - v uvlo2 -0.5 - v vcc recharge start voltage v chg1 7.70 8.70 9.70 v vcc recharge stop voltage v chg2 12.00 13.00 14.00 v latch mask time t latch 50 100 150 us thermal shut down temperature t sd 110 - - c control ic [pwm type dcdc driver block] oscillation frequency 1 f sw1 60 65 70 khz fb=2.00v oscillation frequency 2 f sw2 20 25 30 khz fb=0.40v frequency hopping width 1 f del1 - 4.0 - khz fb=2.0v hopping fluctuation frequency f ch 75 125 175 hz soft start time 1 t ss1 0.30 0.50 0.70 ms soft start time 2 t ss2 0.60 1.00 1.40 ms soft start time 3 t ss3 1.20 2.00 2.80 ms soft start time 4 t ss4 4.80 8.00 11.20 ms maximum duty d ma x 68.0 75.0 82.0 % fb pin pull-up resistance r fb 23 30 37 k ? fb / cs gain gain - 4.00 - v/v fb burst voltage v bst 0.300 0.400 0.500 v fb drop fb voltage of starting frequency reduction mode v dlt 1.100 1.250 1.400 v fb olp voltage 1a v folp1a 2.60 2.80 3.00 v overload is detected (fb rise) fb olp voltage 1b v folp1b - 2.60 - v overload is detected (fb drop) fb olp on timer t f olp1 40 64 88 ms fb olp start up timer t folp1b 26 32 38 ms fb olp off timer t folp2 358 512 666 ms [ove r current detection block] overcurrent detection voltage v cs 0.380 0.400 0.420 v ton=0us overcurrent detection voltage ss1 v cs_ss1 - 0.100 - v 0[ms] ~ tss1[ms] overcurrent detection voltage ss2 v cs_ss2 - 0.150 - v tss1 [ms] ~ tss2 [ms] overcurrent detection voltage ss3 v cs_ss3 - 0.200 - v tss2 [ms] ~ tss3[ms] overcurrent detection voltage ss4 v cs_ss4 - 0.300 - v tss3 [ms] ~ tss4 [ms] leading edge blanking time t leb - 250 - ns over current detection ac voltage compensation factor k cs 12 20 28 mv/us source pin short protection voltage v cssht 0.020 0.050 0.080 v [ start circuit block ] start current 1 i start1 0.100 0.500 1.000 ma vcc= 0v start current 2 i start2 1.000 3.000 6.000 ma vcc=10v off current i start3 - 10 20 ua inflow current from drain pin after uvlo released uvlo. when mosfet is off start current switching voltage v sc 0.800 1.500 2.100 v
4/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 pin descriptions table 1 pin description no. pin name i/o function esd diode vcc gnd 1 source i/o mosfet source pin 2 n.c. - - - - 3 gnd i/o gnd pin - 4 fb i feedback signal input pin - 5 vcc i power supply input pin - 6 drain i/o mosfet drain pin - - 7 drain i/o mosfet drain pin - - i/o equivalent circuit diagram figure 2 i/o equivale nt circuit diagram
5/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 block diagram feedback with isolation ac fuse + - filter diode bridge pwm control leading edge blanking (typ=250ns) vcc uvlo 13. 5 v / 8.2v driver s q r + - current limiter pwm comparator + - + + - burst comparator slope compensation + - 30k + - olp internal block + - vcc ovp 27. 5v 4.0 v soft start ac input compensation osc (65khz) frequency hopping 100us filter 5 4 64ms timer max duty 3 1 12 v clamp circuit 4.0v line reg 7 1m starter 10ua 6 figure 3. block diagram
6/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 description of blocks ( 1 ) start circuit (drian : 6,7pin) this ic built in start circuit (tolerates 650v). it enables to be low standby mode electricity and high speed starting. after starting, consumption power is idling current i start3 typ=10ua only. reference values of starting time are shown in figure-7. when c vcc =10uf it can start less than 0.1 sec. + - vccuvlo vcc cvcc drain fuse + - diode bridge sw1 ac 85- 265 vac figure 4. block diagram of start circuit figure 5. start current vs vcc voltage figure 6. start time( reference value) * start current flows from the drain pin ex) consumption power of start circuit only when the vac=100v pvh 100v* 2*10ua=1.41mw ex) consumption power of start circuit only when the vac=240v pvh 240v* 2*10ua=3.38mw 0.0 ? 0.1 ? 0.2 ? 0.3 ? 0.4 ? 0.5 ? 0.6 ? 0.7 ? 0.8 ? 0.9 ? 1.0 ? 0 5 10 15 20 25 30 35 40 45 50 ?rg [sec] cvcc ? [uf]
7/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (2 ) start sequences (soft start operation, light load operation, and auto recovery operation during overload protection) start sequences are shown in figure 7. see the sections below for detailed descriptions. vout switching vh vcc(1pin) fb(8pin) soft start within 32ms iout normal load light load within 32ms vcc=8.2v over load within 32ms internal ref pull up burst mode a bc d e f gh ij k switching stop vcc=13.5v figure 7. start sequences timing chart a : input voltage vh is applied b : this ic starts operating vcc pin voltage rises when vcc > v uvlo1 (13.5 v typ). switching function starts when other prot ection functions are judged as normal. between the secondary output voltage become constant level, because the vcc pin consumption current causes the vcc value to drop, ic should set to start switching until vcc 8/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (3) vcc pin protection function bm2pxx4 built in vcc low voltage protection function of vccuvlo (under voltage lock out), over voltage protection function of vcc ovp (over voltage protec tion) and vcc charge function that operat es in case of dropping the vcc voltage. this function monitors vcc pin and prevent vcc pin fr om destroying switching mosfet at abnormal voltage. vcc charge function stabilizes the second ary output voltage to be charged from the high voltage line by start circuit at dropping the vcc voltage. (3-1) vcc uvlo vcc ovp function vccuvlo is auto recovery comparator. vccovp is aut o recovery comparator that has voltage hysteresis. refer to the operation figure-8. vccovp operates detection in case of continuing vcc pin voltage > v ovp typ=27.5v . this function built in mask time t latch typ=100us .by this function, this ic ma sks pin generated surge etc. vccuvlo1=13.5vtyp on off vovp1=27.5vtyp vchg2= 8.7vtyp on off off on off a bc d f off g h ij vccuvlo2 8.2vtyp a vovp1=23.5vtyp on on off on vchg1=13.0vtyp e figure 8. vcc uvlo / ovp timing chart a:drain voltage input, vcc pin voltage starts rising. b:vcc>vuvlo1, dc/dc operation starts c:vcc< v chg1 , vcc charge function operates and the vcc voltage is rise. d:vcc > v chg2, vcc charge function is stopped. e:vcc > v ovp1 continues t latch (typ =100us), switching is stoppe d by the vccovp function. f:vcc < v ovp2 , dc/dc operation restarts g:vh is open.vcc voltage is fall. h:same as c. i:same as d. j: vcc 9/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 3-2 vcc charge function vcc charge function oper ates once the vcc pin >v uvlo1 and the dc/dc operation starts t hen the vcc pin voltage drops to v chg2, charge is stopped. the operatio ns are shown in figure-10. vcc v uvlo1 v uvlo2 v chg1 switching vh charge charge charge output voltage v chg2 charge charge abcdefgh vh figure 9. charge operatio n vcc pin charge operation a:drain pin voltage rises, charge starts to vcc pin by the vcc charge function. b:vcc > v uvlo1, vcc uvlo function releases, vcc charge func tion stops, dc/dc operation starts. c:when dc/dc operation starts, the vcc voltage drops. d:vcc < v chg1 , vcc recharge function operates. e:vcc > v chg2 , vcc recharge function stops. f:vcc < v chg1, vcc recharge function operates. g:vcc < v chg1 , vcc recharge function stops. h:after start of output voltage finished, vcc is charged by the auxiliary winding vcc pin stabilizes.
10/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ( 4 ) dcdc driver (pwm comparator, frequency hopping, slope compensation, osc, burst) bm2pxx4 is current mode pwm control. an internal oscillator sets a fixed switching frequency (65khz typ). bm2pxx4 is integrated switching freq uency hopping function which changes the switching fr equency to fluctuate as shown in figure 11 below. the fluctuation cycle is 125 hz typ. 65 switching frequency [khz] 69 125 hz(8ms) time 61 62 63 64 66 68 67 500us figure 10. frequency hopping function max duty cycle is fixed as 75% (typ) and min pulse width is fixed as 400 ns (typ). with current mode control, when the duty cycle exceeds 50% sub harmonic oscillation may occur. as a countermeasure to this, bm2pxx4 is built in slope compensation circuits. bm2pxx4 is built in burst mode circuit and frequency reduction circuit to achieve lower power consumption, when the load is light. fb pin is pull up by r fb (30 k ? typ). fb pin voltage is changed by secondary output voltage (secondary load power). fb pin is monitored, burst mode op eration and frequency detection start. figure 11 shows the fb voltage, and switching frequency, dcdc operation ? mode1 : burst operation ? mode2: frequency reduction operation. ? mode3 : fixed frequency operation. (operate at the max frequency) ? mode4 : over load operation.(detect the over load state and stop the pulse operation) figure 11. switching operation state changes by fb pin voltage
11/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (5) over current limiter bm2pxx4 is built in over current limiter per cycle. if the source pin over a certain voltage, switching is stopped. it is also built in ac voltage compensation function. the function is rise over current limiter level by ti me to compensate ac voltage. shown in figure-12,13, 14. figure 12. no ac voltage compensation function figure13. buit-in ac compensation voltage primary peak current is decided as the formula below. primary peak current: i peak = v cs /rs + v dc / lp *t delay v cs over current limiter voltage internal ic, rs current detection resistance, v dc input dc voltage, l p primary inductance, t delay delay time after detection of over current limiter figure 14. over current limiter voltage 6 l.e.b blanking period when the driver mosfet is turned on, surge current occurs at each capacitor component and drive current. therefore, when source pin voltage rises te mporarily, the detection errors may occu r in the over current limiter circuit. to prevent detection errors, drain is switched from high to low and the source signal is masked for 250 ns by the on-chip leb (leading edge blanking) function.
12/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 (7) source pin (1pin) s hort protection function when the source pin (1pin) is shorted, bm2pxx4 is over heat. bm2pxx4 built in short protection function to prevent destroying. (8) source pin (1pin) open protection if the source pin becomes open , bm2pxx4 may be damaged. to prevent to be damaged, bm2pxx4 built in open protection circuit auto recovery protection . (9) output over load protection function fb olp comparator the output overload protection f unction monitors the secondary output load stat us at the fb pin, and stops switching when an overload occurs. when there is an overload, the output vo ltage is reduced and current no longer flows to the photo coupler, so the fb pin voltage rises. when the fb pin voltage > v folp1a (2.8 v typ) continuously for the period t folp (32ms typ), it is judged as an overload and stops switching. when the fb pin > v folp1a (2.8 v typ), if the voltage goes lower than v folp1b (2.6v typ) during the period t folp (32ms typ), the overload protection timer is reset. the swit ching operation is performed during this period t folp (32ms typ). at startup, the fb voltage is pulled up to the ic?s internal voltage, so operation starts at a voltage of v folp1a (2.8 v typ) or above. therefore, at st artup the fb voltage must be set to go to v folp1b (2.6 vtyp) or below during the period t folp (32ms typ), and the secondary output voltage?s start time must be set within the period t folp (32ms typ) following startup of the ic. recovery from the once detection of fbolp, after the period t folp2 (512 ms typ) figure 15. over load protection (auto recovery) a: the fbolp comparator detects over load for fb>v folp1a b: states of a continuously for the period t folp (32ms typ), it is judged as an overload and stops switching. c: while switching stops for the over load protection function, the vcc pin vo ltage drops and vcc pin voltage reaches < v chg , the vcc charge function operates so the vcc pin voltage rises. d: vcc charge function stops when vcc pin voltage > v chg2 e: if t olpst typ =512ms go on from b point, switching function starts on soft start. f: if t folp typ=32ms go on from e point to continues a overload condition (fb>v folp1a ), switching function stops at f point. g: while switching stops vcc pin voltage drops to < v chg1 , vcc charge function operates and vcc pin voltage rises. h: if vcc pin (1pin) voltage becomes over v chg2 by the vcc charge function, vcc charge function operation stops
13/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operation mode of protection circuit operation mode of protection f unctions are shown in table2. table2 operation mode of protection circuit function operation mode vcc under voltage locked out auto recovery vcc over voltage protection auto recovery tsd latch with 100us timer fb over limited protection auto recovery with 64ms timer source short protection auto recovery source open protection auto recovery sequence the sequence diagram is show in fig 16. all condition transits off mode vcc<8.2v figure 16. the sequence diagram 13 .5 v soft start 1 all mode time > 2 .0 ms soft start time > 8 .0 ms fb< 0 .40 v burst mode ( pulse off ) fb> 0 .40 v normal mode off mode olp mode ( pulse stop ) fb> 2 .80 v fb< 2 . 60 v latch off mode ( pulse stop ) temp>145 vcc< 7 .7 v vcc< 8 .2 v time > 0 . 5 ms soft start 2 time > 1 .0 ms soft start 3 pulse off fb> 2 .80v (32ms) fbolp off timer ( 512ms ) vcc ovp (pulse stop ) vcc> 27.5 v vcc< 23.5 v source open ( pulse stop ) open normal source short ( pulse stop ) normal short
14/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 thermal loss the thermal design should set operation for the following conditions. (since the temperature shown below is the guaranteed tem perature, be sure to take a margin into account.) 1. the ambient temperature ta must be 105 or less. 2. the ic?s loss must be within the allowable dissipation pd. the thermal abatement characteristics are as follows. (pcb: 74.2 mm 74.2mm 1.6 mm, m ounted on glass epoxy substrate) figure 17. dip7 thermal abatement characteristics 0 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 150 pd[mw] ta[ ]
15/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ordering information b m 2 p x x 4 - product name package none: dip7 packaging and forming specification none: tube physical dimension tape and reel information dip7 making diagram line-up dip7 product name (bm2pxx4) BM2P014 bm2p034 bm2p054 bm2p094 ? order quantity needs to be multiple of the minimum quantity. tube container quantity direction of feed 2000pcs direction of products is fixed in a container tube
16/16 datasheet d a t a s h e e t bm2pxx4 series tsz02201-0f2f0a200070-1-2 28.nov.2012.rev.003 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 use-related cautions (1) absolute maximum ratings damage may occur if the absolute maximum ratings such as for applied voltage or operating temperature range are exceeded, and since the type of damage (short, open circuit, etc.) cannot be determi ned, in cases where a particular mode that may exceed the absol ute maximum ratings is considered, use of a physical safety measure such as a fuse should be investigated. (2) power supply and ground lines in the board pattern design, power supply and ground lines should be routed so as to achieve low impedance. if there are multiple power supply and ground lines, be careful wi th regard to interference caused by common impedance in the routing pattern. with regard to ground lines in particular, be careful regarding the separation of large current routes and small signal routes, including the external circuits. also , with regard to all of the lsi?s power supply pins, in addition to inserting capacitors between the power supply and ground pins, when using capacitors there can be problems such as capacitance losses at low temperature, so check thoroughly as to whet her there are any problems with the characteristics of the capacitor to be used before determining constants. (3) ground potential the ground pin?s potential should be set to the mini mum potential in relation to the operation mode. (4) pin shorting and attachment errors when attaching ics to the set board, be careful to avoid errors in the ic?s orientation or position. if such attachment errors occur, the ic may become damaged. also, damage may occur if foreign matter gets between pins, between a pin and a power supply line, or between ground lines. (5) operation in strong magnetic fields note with caution that these products may become damaged when used in a strong magnetic field. (6) input pins in ic structures, parasitic elements are inevitably formed according to the relation to potential. when parasitic elements are active, they can interfere with circuit operatio ns, can cause operation faults, and can even result in damage. accordingly, be careful to avoid use methods that enable para sitic elements to become active, such as when a voltage that is lower than the ground voltage is app lied to an input pin. also, do not apply voltage to an input pin when there is no power supply voltage being applied to the ic. in fact, even if a power supply voltage is being applied, the voltage applied to each input pin should be either below the power supply vo ltage or within the guaranteed values in the electrical characteristics. (7) external capacitors when a ceramic capacitor is used as an external capacitor, consider possible reduction to below the nominal capacitance due to current bias and capacitance fluct uation due to temperature and the like before determining constants. (8) thermal design the thermal design should fully consider allowable dissipation (pd) under actual use conditions. also, use these products within ranges that do not put output tr beyond the rated voltage and aso. (9) rush current in a cmos ic, momentary rush current may flow if the intern al logic is undefined when the power supply is turned on, so caution is needed with regard to the power supply coup ling capacitance, the width of power supply and gnd pattern wires, and how they are laid out. (10) handling of test pins and unused pins test pins and unused pins should be handled so as not to caus e problems in actual use conditions, according to the descriptions in the function manual, app lication notes, etc. contact us regard ing pins that are not described. (11) document contents documents such as application notes are design documents used when designing applications, and as such their contents are not guaranteed. before finalizing an applicati on, perform a thorough study and evaluation, including for external parts. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, ro hm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified bel ow), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin c onsidering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a hum idity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contain ed in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet d a t a s h e e t notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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